We are excited to inform our clients about the pre-release of a new Broad Agency Announcement (BAA) topic by the Department of Defense. This announcement is crucial for businesses involved in defense technologies and innovations. Below, we provide comprehensive details about the topic, important dates, and guidance to help you navigate the submission process successfully.
New BAA Topic Pre-Release: DMEA244-P01
The Department of Defense has pre-released the following BAA topic under the Defense Microelectronics Activity (DMEA):
DMEA244-P01: “Modeling, Optimization, and Monitoring of Thick SiC Epitaxy Processes Open Topic”
Full solicitation documents, component-specific instructions, and topic descriptions are available on the Defense SBIR/STTR Innovation Portal (DSIP). To access these documents, visit DSIP Active Solicitations and select the appropriate BAA cycle and release number.
Important Dates
To ensure you meet all deadlines, please take note of the following key dates:
- July 16, 2024: Topic pre-releases
- August 13, 2024: Topic opens, and proposal submissions begin in DSIP
- August 27, 2024: Topic Q&A closes to new questions at 12:00 p.m. ET
- September 10, 2024: Topic closes, and full proposals must be submitted in DSIP no later than 12:00 p.m. ET
Topic Q&A
During the pre-release period, proposers can take advantage of the Topic Q&A feature. This platform allows you to submit technical questions to improve your understanding of the topic requirements. Please note that questions should be focused on technical aspects and not on seeking advice or guidance on the solution approach or administrative questions.
- Pre-release Period: Direct contact with Topic Points of Contact (TPOCs) or via Topic Q&A.
- Post Pre-release: Once the topic opens on August 13, 2024, proposers cannot directly contact topic authors. All questions and answers will be posted electronically for public viewing.
- Q&A Closure: New questions can be submitted until August 27, 2024, at 12:00 p.m. ET. The Q&A section will remain active for viewing until the BAA closes.
Customer Support Guide
To help your firm navigate the DoD SBIR/STTR proposal process efficiently, we have compiled a Customer Support Guide. This guide includes essential dos and don’ts to ensure your proposal is prepared accurately and submitted on time.
Additional Resources
For further assistance, the Learning & Support section on DSIP offers various resources, including job aids and help videos. These materials are designed to guide you through the proposal preparation and submission process. Access these resources at the following link: Learning & Support – Training Materials.
Final Thoughts
We encourage all eligible firms to take advantage of this opportunity and prepare their proposals diligently. This BAA pre-release represents a significant chance to contribute to advancements in modeling, optimization, and monitoring of thick SiC epitaxy processes.
For continuous updates and to stay informed about any amendments to the topics, please regularly monitor the DSIP portal. Should you have any questions or need further assistance, feel free to reach out through the appropriate channels mentioned above.
We look forward to seeing your innovative proposals and wish you the best of luck in the submission process.
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